Features of thermal conductive sealant of TensanThermal conductive sealant has good resistance to high and low performance, use for a long time will not fall off, do not produce contact gap because of the high bonding strength. The main application is to replace thermal conductive sealant for CPU and radiator, thyristor module and intelligent control radiator, high-power electric filling adhesive between the module and the radiator. By using this thermal compound , the result is more reliable to fill the cooling, simpler process and more economic cost.
Features of thermal conductive sealant of Tensan
1. In exceptional fluidity with spontaneous levelling after mixing the A and B components.
2. In splendid electrical isolation, anti-moisture, non-contraction with remarkable stability.
3. It has no contraction and temperature rising phenomenon during the consolidation process.
4. It is in elastomer character after consolidation procedure, with excellent anti-thixotropy between the cold and hot condition, also in remarkable aging endurance performance.