What are the advantages of thermally conductive double-sided tape over other thermally conductive materials?
In order to solve the heat dissipation problem of electronic and electrical products and to ensure the stability and performance of the products, different types of thermally conductive materials are usually required. Shenzhen Tensan tells you: the advantages of thermal conductive double-sided tape compared to other thermal conductive materials.
Thermally conductive double-sided adhesive tape is a thermally conductive material used to bond heat sinks and other power-consuming semiconductors. It has high-performance thermal conductivity, strong adhesive strength, and low thermal resistance. It can effectively conduct heat and fix The role. In terms of adhesion performance, many common thermal conductive materials do not have tackiness, which is not easy to stick to important parts of electronic products and cannot be effectively fixed on the surface of the chip, but the thermal conductive double-sided adhesive is cleverly filled with thermal conductive material in the middle, which has excellent thermal conductivity. At the same time, it has strong adhesiveness and can solve the problem of bonding and fixing electronic components.
In terms of thermal conductivity, the thermal conductivity of thermal double-sided adhesive tape is better than that of ordinary thermal stickers. The thermal conductivity is high and stable. It can work for at least 5 years at room temperature, which greatly improves the life of electronic components. The best choice. And the thermal conductive double-sided tape is the same as the thermal conductive silicone sheet. It can be die-cut into any shape according to the requirements during production. It can be bonded with light pressure during use. The bonding strength increases with time and the temperature increases. It has good convenience and practicality in use. Currently widely used in LED, mobile phones, computers, home appliances, auto parts and other electronic products to dissipate heat.
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