Typical Properties of Thermal Conductive Adhesive TS5505
|
Item |
Index |
|
Appearance |
White semi-flow |
|
Tack free time( min ) |
5～15 |
|
Complete cure time 25℃(H) |
24 |
|
Viscosity(KCPS) |
60 |
|
Specific Gravity( g/cm3) |
2.0±0.02 |
|
Thermal Conductivity (w/m.k) |
1.0 |
|
Thermal Resistance @50psi |
0.08 |
|
Break Down Voltage (K Vac/mm) |
>6 |
|
Dielectric Constant @1Mhz |
6.0 |
|
Hardness( Shore ) ≥ |
65 |
|
Tensile Strength ( Mpa ) ≥ |
2.0 |
|
Breaking Elongation ( % ) ≥ |
180 |
|
Volume Resistivity ( Ω.cm3 ) ≥ |
5.0×1014 |
|
Temperature range( ℃ ) |
-50～200 |
|
Flame resistance |
V-0 |
Typical Applications of Thermal Conductive Adhesive
This material is widely applied in electronics products like consumer electronics, power supply , lamp devices etc.
◆ Used to replace thermal grease for CPU and its heat sink conductor
◆ To use in SCR intellectualized control module and its radiator
◆ Use to fill the gap between electronic module and radiator and make heat conduct
Packing Information of Thermal Conductive Adhesive
1. Hard plastic tube 100 ml
100 tubes / carton
2. Hard plastic tube 300 ml
24 tubes / carton
3. Hard plastic tube 2600ml
4 tubes / carton
4. Customized packing is acceptable
Storage and Validity of Thermal Conductive Adhesive
Keep away from children .
Stored in a cool, ventilated, dry place.
Shelf life: 6 months
Other Information
The above information are correct, but does not contain all of the information and can only be used as a guide.
This product is ROHS, REACH compliant. It does not contain any unknow carcinogenic, mutagenic or teratogenic components.
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