Alloy: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu) For other alloys, please contact your local Tensan sales office.

Powder size:

Powder No. 4 (20-38μm, according to IPC J-STD-005)

Residue: approx. 5% (w/w)

Package sizes: 500 gram cans, 6" and 12" sticks, DEK ProFlo® boxes and 10cc and 30cc tubes.

Fluxes: TS-350 fluxes are available in 10cc and 30cc tubes for rework applications.

Lead Free System: Compliant with RoHS Directive 2002/95/EC.

Product Description:

TS-350 is a widely used, lead-free, no-clean solder paste. QFN-350 solder paste offers    performance similar to that of tin-leadprocesses.
TS-350 solder paste achieves theindustry‘s best head rest defect resistance and first pass yields on in-line testing.
 TS-350demonstrates excellent print performance, especially in applications with ultra-fine pitch repeatability (11 mil square) and high yield requirements.

 
Product Application:

Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec) and 150mm/sec (6”/sec), with stencil thickness of 100μm (4 mil) to 150μm (6 mil), particularly when used with ALPHA® Stencils. Blade pressures should be 0.18-0.27 kg/cm of blade (1.0 -1.5 Ibs/inch), depending upon the print speed. The higher the print speed employed, the higher the blade pressure that is required. The reflow process window will give high soldering yield with good cosmetics and minimized rework.

Product Storage:

Although  TS-350   is   not  toxic,  its  typical reflux process produces a small amount of reaction and vapor decomposition. TS-350 should be stored in a refrigerator at 0-10C (32-

50° F).

TS-350  solder  paste  can  be  kept at  room temperature  before  opening  the  package for use, which  helps  prevent  condensation  on the surface of the paste.