Tensan Red Glue vs. Other Red Glues Comparison Report

I. Introduction

In the electronics assembly industry, red glues are widely used for the fixation of surface mount components to ensure that the components do not shift during the wave soldering or reflow soldering process. Different brands and types of red glues have varying performance characteristics. This comparison will focus on Tensan red glue and other common red glues to gain a deeper understanding of their respective features and advantages.

II. Performance Comparison

(I) Viscosity

Tensan Red Glue: It has excellent initial viscosity and can quickly and firmly bond the components onto the PCB board after placement. Even in the presence of slight vibrations or during handling, it can effectively prevent component displacement. Its viscosity remains stable with minimal fluctuations under different ambient temperature and humidity conditions, providing a reliable guarantee for the subsequent soldering process.

Other Red Glues: The initial viscosity generally meets the basic requirements for component fixation during placement. However, under some harsh environmental conditions, such as high temperature and high humidity, the viscosity may decrease to a certain extent, leading to a slight movement risk of the components, which in turn affects the soldering quality and product reliability.

(II) Curing Characteristics

Tensan Red Glue: It has a relatively fast curing speed. Under the recommended curing conditions, it can reach the ideal curing strength in a short time, effectively improving production efficiency. At the same time, its curing process is stable. The cured glue layer has good heat resistance and chemical resistance, and can withstand the high-temperature impact during wave soldering or reflow soldering and the erosion of chemical substances such as flux, without softening, cracking or decomposition.

Other Red Glues: The curing speeds vary. Some red glues have a longer curing time, which may prolong the production cycle. Moreover, their performance in heat resistance and chemical resistance after curing is relatively weak. In a high-temperature soldering environment, the glue layer may deform, affecting the fixation effect of the components and even leading to poor soldering or component detachment.

(III) Shape and Consistency of Glue Dots

Tensan Red Glue: When dispensing glue with advanced dispensing equipment, it can precisely control the shape and size of the glue dots, and the glue dots exhibit good consistency. Whether they are round, square or other special shapes, they can meet the requirements of high-precision surface mount technology. This consistency helps to ensure that each component obtains uniform bonding force and improves the overall quality stability of the product.

Other Red Glues: During the glue dispensing process, it is relatively difficult to control the shape of the glue dots, and it is easy to have glue dots of different sizes and irregular shapes. This may lead to insufficient or excessive bonding force for some components, affecting the electrical performance and reliability of the product and increasing the scrap rate and debugging cost during the production process.

(IV) Cleaning Performance

Tensan Red Glue: It has good cleaning performance. After soldering, if it is necessary to clean the PCB board to remove the residual red glue, Tensan red glue can be effectively removed under conventional cleaning solvents and process conditions, without leaving difficult-to-remove residues on the PCB board, thus ensuring the cleanliness of the PCB board and the accuracy of subsequent electrical performance testing.

Other Red Glues: Some other red glues have poor cleaning performance and may require special cleaning solvents or an increase in cleaning time and intensity to completely remove the residual red glue. This not only increases the cleaning cost but also may cause potential damage to other sensitive components or circuits on the PCB board, affecting the long-term reliability of the product.

(V) Reliability

Tensan Red Glue: After long-term practical verification and strict reliability testing, Tensan red glue shows excellent reliability under various harsh environmental conditions, such as temperature cycling, humidity changes, and mechanical vibrations. The components bonded by it can maintain a stable connection state during long-term use, greatly reducing the risk of product failure caused by red glue failure and improving the service life and overall reliability of the product.

Other Red Glues: They are relatively weak in terms of reliability. Under the action of long-term environmental stress, the bonding interface between the red glue and the components or the PCB board may show aging, cracking and other phenomena, resulting in poor electrical connection, affecting the performance and stability of the product. Especially in some application fields with high reliability requirements, such as automotive electronics and aerospace, this reliability difference may have a significant impact on the safety of the entire system.

III. Cost-Effectiveness Comparison

(I) Production Efficiency

Tensan Red Glue: Its fast curing speed, good consistency of glue dots and high reliability contribute to improving the overall production efficiency on the production line. It reduces time wasted on waiting for the red glue to cure, adjusting glue dispensing parameters and dealing with production interruptions caused by red glue problems, enabling the production line to run more smoothly and effectively increasing the output per unit time.

Other Red Glues: Due to factors such as slow curing speed and unstable glue dispensing performance, they may reduce production efficiency and increase the production cycle. In large-scale production, this efficiency difference may cause enterprises to miss market opportunities, reduce competitiveness, and also increase the occupation cost of equipment and manpower.

IV. Application Field Comparison

(I) Consumer Electronics

Tensan Red Glue: In the field of consumer electronics, such as smartphones, tablets, and smart wearable devices, due to the small size of products, high component density, and strict requirements for production efficiency and product reliability, Tensan red glue‘s high-precision glue dispensing performance, fast curing and good reliability can well meet the production needs, ensuring the stability and performance of products during long-term use.

Other Red Glues: Although they can also be applied in the field of consumer electronics, when facing some high-end products or production links with extremely demanding processes, they may encounter some performance bottlenecks. For example, they may not be able to provide precise enough glue dots for fixing tiny components, or their reliability performance under high temperature and high humidity environments may be poor, affecting product quality and user experience.

(II) Automotive Electronics

Tensan Red Glue: The automotive electronics system has extremely high requirements for reliability because its working environment is complex and changeable, including large temperature fluctuations, strong vibrations, and the existence of various chemical substances that can cause erosion. Tensan red glue‘s excellent heat resistance, chemical resistance and long-term reliability make it an ideal choice for the automotive electronics field, ensuring that key components such as automotive electronic control units and sensors can work stably under harsh conditions, thus guaranteeing the safety and reliability of automobiles.

Other Red Glues: The application of ordinary red glues in the automotive electronics field may be limited. Due to their insufficient reliability, they are difficult to meet the strict quality standards and regulatory requirements of automotive electronics. During long-term use, they may cause automotive electronic system failures due to red glue failure, triggering safety hazards. Therefore, they are less used in high-end applications in the automotive electronics field.

(III) Industrial Control

Tensan Red Glue: In the industrial control field, equipment usually needs to run stably for a long time in a relatively harsh industrial environment, and has high requirements for the fixation and connection reliability of electronic components. Tensan red glue‘s good performance can adapt to factors such as temperature changes, dust pollution, and electromagnetic interference in the industrial environment, ensuring the normal operation of industrial control equipment, reducing equipment failures and downtime caused by red glue problems, and improving production efficiency and equipment utilization.

Other Red Glues: Some other red glues may experience performance degradation in an industrial control environment. For example, the glue layer may soften under high temperature conditions, resulting in component displacement, or the electrical performance may be affected under electromagnetic interference conditions, thus affecting the stability and reliability of industrial control equipment, increasing maintenance costs and production risks.

V. Conclusion

In summary, Tensan red glue shows obvious advantages over other ordinary red glues in terms of viscosity, curing characteristics, shape and consistency of glue dots, cleaning performance, and reliability. In terms of cost-effectiveness, considering factors such as the improvement of production efficiency and the reduction of the scrap rate, its overall cost-effectiveness is more prominent. In terms of application fields, Tensan red glue can be widely used in fields such as consumer electronics, automotive electronics, and industrial control that have high requirements for performance and reliability, providing a powerful guarantee for the high-quality production of electronic products. Therefore, when choosing red glue products, enterprises should weigh the advantages and disadvantages of Tensan red glue and other red glues according to their own production process requirements, product application fields, and comprehensive considerations of cost-effectiveness to make the most appropriate choice.