Multi-dimensional In-depth Comparison between TENSAN Electronic Adhesive and Other Electronic Adhesives

I. Bonding Performance

• TENSAN Electronic Adhesive: It demonstrates outstanding bonding strength. It can form high-strength bonds with common metals like copper and aluminum, engineering plastics such as ABS and PC, as well as ceramics. For example, in the bonding of chips and heat sinks inside a smartphone, it ensures a tight connection and effective heat transfer. Its bonding strength has withstood rigorous tests and remains stable under complex working conditions such as vibration and dropping, providing reliable support for precision electronic components.
• Other Electronic Adhesives: Some brands have shortcomings when bonding specific combinations of materials. The bonding strength of some adhesives between metals and plastics is insufficient, and delamination is likely to occur. Especially after long-term use of electronic products and experiencing temperature cycle changes, the risk of loosening at the bonding site increases, affecting the overall performance and lifespan of the device.

II. Thermal Conductivity

• TENSAN Electronic Adhesive: It possesses good thermal conductivity. Some of its products have a relatively high thermal conductivity coefficient, which can meet the heat dissipation requirements of high heat flux areas such as between a computer CPU and a radiator and power amplifier modules. It quickly conducts heat away to prevent local overheating from damaging electronic components and ensures the stable operation of the device.
• Other Electronic Adhesives: Many ordinary electronic adhesives do not focus on optimizing thermal conductivity, and their thermal conductivity coefficients are low. They struggle to handle the heat dissipation of high-power electronic devices, resulting in heat accumulation, reduced device operation efficiency, and shortened component lifespan. They cannot adapt to the increasingly stringent heat dissipation requirements in the development of modern electronic products towards miniaturization and high performance.

III. Curing Characteristics

• TENSAN Electronic Adhesive: It has diverse and flexible curing conditions. Some products can cure relatively quickly at room temperature, which is convenient for application scenarios that are sensitive to temperature or have limited on-site construction conditions. There are also models that can rapidly cure to achieve optimal performance under specific high-temperature conditions, meeting different production process requirements. After curing, the physical and chemical properties of the adhesive are stable, and it has good dimensional stability.
• Other Electronic Adhesives: Some competing products have a single curing method and strict requirements for environmental temperature and humidity. For example, some adhesives must be cured in a dust-free workshop with constant temperature and humidity; otherwise, incomplete curing will occur, resulting in weak adhesion, easy cracking, and other problems, greatly limiting their range of use and convenience.

IV. Temperature Resistance

• TENSAN Electronic Adhesive: It has an excellent temperature resistance range and can maintain stable performance from low to high temperatures. In extremely cold outdoor electronic devices such as meteorological monitoring station instruments, it will not fail due to low-temperature embrittlement. Near the heat source of high-temperature industrial control equipment, it is not afraid of thermal degradation and always maintains good bonding and protection functions, ensuring the integrity of electronic circuits and components.
• Other Electronic Adhesives: Many electronic adhesives have a narrow temperature resistance interval. At low temperatures, they may become hard and brittle, causing cracks at the bonding site and loosening of electronic components. At high temperatures, they may soften and flow, losing their bonding effectiveness and unable to provide reliable protection for electronic products in complex thermal environments.

V. Environmental Performance

• TENSAN Electronic Adhesive: It adheres to the concept of environmental protection. The use of harmful chemical substances is minimized during the production process, and the finished adhesive has a low content of volatile organic compounds (VOCs), posing little harm to the health of operators. It also complies with increasingly strict environmental regulations and is especially suitable for use in relatively closed spaces such as electronic manufacturing workshops.
• Other Electronic Adhesives: Some traditional electronic adhesives contain a large amount of organic solvents, such as toluene and xylene. They emit a pungent smell during use, not only endangering the respiratory health of workshop workers but also, during the waste disposal process of the products, these harmful substances are likely to pollute the environment, facing increasing pressure from environmental supervision.

VI. Stability and Reliability

• TENSAN Electronic Adhesive: It has been verified through a large number of long-term experiments and practical applications and has high stability and reliability. During the several-year or even decades-long service life of electronic products, the performance of the adhesive will not fluctuate significantly. It can continuously play a key role in the fixation, protection, and heat dissipation of electronic components, reducing the failure rate of the device.
• Other Electronic Adhesives: Some small-brand or low-quality electronic adhesives may perform reasonably well in the short term. However, over time, affected by factors such as light, oxidation, and humidity, they are prone to problems such as aging, discoloration, and adhesion degradation, bringing hidden dangers to the later maintenance and continuous stable operation of electronic products.

VII. Price and Cost-effectiveness

• TENSAN Electronic Adhesive: Its price positioning is based on its high quality and high performance and is at the mid-to-high end of the market. Although the initial procurement cost may be relatively high, considering the long-term stable operation guarantee it provides for electronic products, the reduction in failure repair costs, and its ability to meet complex process requirements, it has significant cost-effectiveness advantages.
• Other Electronic Adhesives: The price range is wide. Low-end products are inexpensive but often cannot meet the strict requirements of high-end electronic manufacturing. Frequent quality problems lead to additional cost expenditures. High-end brand products of the same type may have a similar or even higher price than TENSAN, but TENSAN outperforms them in some subdivided performances or overall supporting services, providing customers with a more competitive choice.