Typical Properties of Excellent Heat Resistance Silicone Encapsulant Waterproof TS8866
|
Item |
Index |
|
Color |
Part A: Gray |
|
Viscosity mPa·s (25℃) |
Part A:4500 Part B: 3500 |
|
Specific Gravity ( Cured ) |
1.9 |
|
Mix Ratio |
1:1 |
|
Viscosity mPa·s (25℃) |
4200 |
|
Density g/cm3 (25℃) |
1.60 |
|
Working Time at 25℃ (minutes) |
30-60 |
|
Heat Cure Time Hr/℃ |
0.5/80 |
|
Hardness (Shore A) |
50 |
|
ThermalConductivity (W/mK) |
0.7 |
|
DielectricConstant (1MHz 25℃) |
2.5 |
|
Dielectric Strength kV/mm (25℃) |
>18 |
|
VolumeResistivity (DC500V ) Ω· cm |
1.5×1015 |
|
UL 94 Flame Classification |
94 V-1 |
Description of Thermally Conductive Encapsulant
Tensan silicone 1 to 1 encapulants are supplied as two part liquid component kits.
After mixing, two parts silicone will be cured as a flexible elastomer, which is well used for the protection of electrical and PCB system assemble application.
The duration of application and the curing time at room temperature are independent of the number of materials.
Packing Information of Thermally Conductive Encapsulant
20KG/25KG/BUCKET
24 BUCKET/PALLET
Storage and Validity of Thermally Conductive Encapsulant
Stored in room temperature, and in a cool, ventilated, dry place.
Shelf life: 6 month
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