Comparative Analysis of Tensan Thermal Pads and Other Thermal Pads

I. Introduction

II. Comparison of Thermal Conductivity

1. Tensan Thermal Pads
   • Utilize advanced thermal conductive material formulations and unique manufacturing processes, possessing excellent thermal conductivity. The thermal conductivity coefficient is at a relatively high level, enabling efficient heat transfer from the heat source, significantly improving heat dissipation efficiency, effectively reducing the operating temperature of the device, creating a stable temperature environment for electronic components, and strongly guaranteeing the reliability and service life of the device. For example, in the heat dissipation application of high-performance CPUs, Tensan thermal pads can quickly transfer the heat generated by the CPU to the heat sink, ensuring that the CPU temperature is maintained within a reasonable range, effectively avoiding performance degradation and failures caused by overheating.
2. Other Thermal Pads
   • Some ordinary thermal pads in the market have a relatively low thermal conductivity coefficient, and their heat transfer efficiency is significantly inferior to that of Tensan thermal pads. Under the same heat dissipation conditions, these ordinary thermal pads cannot quickly and effectively dissipate the heat, resulting in heat accumulation at the heat source, which has an adverse impact on the normal operation of the device. For instance, in some low-power electronic devices, although ordinary thermal pads can temporarily meet the basic heat dissipation requirements, as the device power increases or the operating environment temperature rises, the insufficient heat dissipation capacity of these pads will gradually become apparent, and the stability of the device will also be challenged.

III. Comparison of Insulation Properties

1. Tensan Thermal Pads
   • Have extremely excellent insulation properties, which can effectively prevent short-circuit problems caused by leakage between electronic components, strongly ensuring the electrical safety of electronic devices. This enables it to be widely used in electronic device fields with strict insulation requirements, such as power modules and battery management systems for electric vehicles. Even under harsh environmental conditions such as high voltage and high humidity, Tensan thermal pads can maintain good insulation performance, providing a reliable guarantee for the stable operation of the device.
2. Other Thermal Pads
   • Some thermal pads have poor insulation performance and may pose safety hazards in some application scenarios with strict insulation requirements. For example, in the high-voltage part of an electronic device, if an insulating thermal pad with poor performance is used, it is very likely to cause leakage phenomena, which will not only interfere with the normal operation of the device but also pose a threat to the personal safety of the operator.

IV. Comparison of Temperature Resistance

1. Tensan Thermal Pads
   • Have good temperature resistance and can maintain stable physical and chemical properties within a wide temperature range. The long-term operating temperature range is wide, and it can also withstand relatively high temperature shocks in the short term without problems such as aging, hardening, and cracking, ensuring reliable heat dissipation under different ambient temperatures. Taking the electronic control system in the engine compartment of a car as an example, Tensan thermal pads can withstand the high temperature generated by the engine operation and the temperature changes of the vehicle under different climatic conditions, and always stably perform its heat dissipation function to ensure the normal operation of the electronic components.
2. Other Thermal Pads
   • Some conventional thermal pads have limited temperature resistance, and the long-term operating temperature range is relatively narrow. Under high-temperature environments, performance degradation is likely to occur, such as a decrease in thermal conductivity and a deterioration in flexibility. When applied to high-temperature environments, these thermal pads often cannot meet the heat dissipation requirements, thereby negatively affecting the performance and reliability of electronic devices. For example, in the temperature control system of an industrial furnace, if a thermal pad with insufficient temperature resistance is used, the device may fail due to the failure of the pad at high temperatures, hindering the normal progress of production.

V. Comparison of Flexibility

1. Tensan Thermal Pads
   • Have good flexibility and can better adapt to different shapes of heat dissipation surfaces, effectively filling gaps to ensure a good contact area and heat conduction path. The Shore hardness is appropriate, which can ensure a tight fit without exerting excessive pressure on the electronic components, effectively avoiding the contact problem caused by uneven pressure and enhancing the stability of the heat dissipation effect. For example, in the complex layout of electronic components inside a notebook computer, Tensan thermal pads can easily fit various shapes of chips and heat sinks, ensuring uniform heat transfer and providing solid support for the stable operation of the notebook computer.
2. Other Thermal Pads
   • Some thermal pads have poor flexibility, and the Shore hardness is relatively high. During the installation process, they may not be able to fully fill the gaps, or when the device is affected by vibration or thermal expansion and contraction, contact problems are likely to occur, affecting the heat conduction effect. For example, in the heat dissipation system of some large servers, due to the large number of electronic components and a compact layout, if a thermal pad with poor flexibility is used, it may lead to poor heat dissipation in some areas, adversely affecting the performance and stability of the entire server.

VI. Comparison of Compression and Rebound Properties

1. Tensan Thermal Pads
   • Exhibit excellent performance in compression and rebound properties. After multiple compression cycles, it can still maintain a high rebound rate and stable thermal conductivity. This means that during long-term use, even under a certain amount of pressure, Tensan thermal pads can quickly return to their original state, ensuring good heat conduction performance and the durability and stability of the heat dissipation effect. For example, during the long-term operation of an electronic device, Tensan thermal pads can withstand the pressure changes of the heat sink and always maintain close contact with the heat source and the heat sink, efficiently transferring heat and effectively avoiding the degradation of heat dissipation performance caused by the compression deformation of the pad.
2. Other Thermal Pads
   • Some ordinary thermal pads have poor compression and rebound properties. After multiple compressions, the rebound rate will often decrease significantly, resulting in a decrease in the contact pressure between the pad and the heat dissipation surface and an increase in thermal resistance, thus adversely affecting the heat dissipation effect. For example, in some frequently started and stopped electronic devices, ordinary thermal pads may experience a decline in heat dissipation performance in a short time due to poor compression and rebound properties, interfering with the normal operation and service life of the device.

VII. Conclusion